Next Generation Technologies Seminar & Design for Excellence Seminar for the Electronic Industry at July 6-7 with Dr. Craig Hillman.
Monday, May 03, 2010
Monday, May 03, 2010
Nistec pleased to announce that it will perform 2-day technology seminar at July 6-7, with the world-wide well known expert, Dr. Craig Hillman, CEO, DfR Solutions, USA.
If you are involved with any aspect of the electronic industry, you should attend this seminar. The seminar will take place at Daniel Hotel, Herzilya and will cover updated technology challenges.
The first seminar will be at July 6. The attendance will learn on Next Generation Technologies in Electronic Packaging and Production. The purpose of this course is to clearly identify new technologies within the component packaging, printed board, circuit assembly, and thermal solution regime, provide insight into the benefits of such technologies, and concisely discuss some of the challenges and risks of implementing these technologies.
The second seminar will be at July 7. The attendance will learn on Design for Excellence. In this course, attendees will receive an overview of the principles of DfX, including Design for Manufacturability (DfM), Design for Reliability (DfR) and Design for Environment (DfE) and the drivers for incorporating DfX into the product development process.