Nistec provides complete manufacturing solutions to satisfy the most demanding customers.
Considered the leader in technological know-how in the field of electronic assembly, Nistec provides. high and low-mix PCB assembly for volumes that range from just a few prototype units, to modest quantities for pre-production, to hundreds of thousands in mass production.
Manufacturing equipment has been carefully selected and optimally deployed to meet prototype, new product introduction (NPI), low volume and high volume requirements.
With three plants encompassing Israel, Nistec can provide complete manufacturing solutions to satisfy the most demanding customer.Advanced manufacturing and production systems at Nistec ensure rapid delivery, while a capable team of experienced engineers provides complex technological solutions and customer consulting.
PCB Assembly Capabilities
- CCGA, LGA
- Micro BGA/QFN
- BGA reballing and rework
- Double-sided, mirrored BGA assembly
- Fine pitch, high pin count press fit connectors
- Flip chip
- RoHS Compliant