Technology webinar on the subject of: High Density Interconnection (HDI) PCB design – 26/03/20

 Technology webinar on the subject of: High Density Interconnection (HDI) PCB design. The technology webinar will take place on Thursday, March 26 from 14:00 to 14:40 by Evgeny Makhline, Nistec Design CTO. To join by Zoom: https://us04web.zoom.us/j/698865024?pwd=MkpJaWNHenhSVEhMKy9hUVo4V2lSUT09

 You are very welcome.