Special technology training on the subject of: PCB Footprint & Placement Tips Every Board Designer Needs to Know
To register:
https://docs.google.com/forms/d/e/1FAIpQLSfCLq0rKBAHvPiJ6EVa0TftzwHGsn0f9112UlFQjAayavxjrg/viewform...
Technology Seminar – Wiring and Cable Design - Elya B. Joffe - October 21 & 28, 2020.
This seminar provides the participants with the necessary tools for identification, analysis and understanding of the electromagnetic phenomena related to electronic equipment cables and wiring design and installation.
The seminar will emphasize the basic principles and practical applications of field to cable interactions, including radiation and coupling of EMI to...
Technology Webinar on the subject of: RF PCB Design. The technology webinar will take place on Wednesday, August 12th from 14:00 to 15:30. To Register: https://docs.google.com/forms/d/e/1FAIpQLSe82X12R9Q3qKCc-0_T-g-XbHTg1wBYCT7hXOcnkp1qMuVQTA/viewform...
Technology Webinar on the subject of: Test Release Process For Successful PCB Production – Nistec with Mentor. The technology webinar will take place on Wednesday, July 8th from 11:00 to 13:00. To Register: https://docs.google.com/forms/d/e/1FAIpQLSeeVnHfjxm9VeEuMruPJXpifkDgz0hJpNuRq1ZdMNzGMPhz3w/viewform...
New Technology Webinar of the subject of: PCB Materials and Design for 5G Systems The technology webinar will take place on Wednesday, June 17th from 14:00 to 16:00. To Register: https://docs.google.com/forms/d/e/1FAIpQLSfss3w0_8VjfsSfKNQmNHG-v0Ttc-V8EkmfBwEs8qzTnRcKbQ/viewform...
Live Tour in Nistec PCB Assembly Line with ZOOM. The tour will take place on Wednesday, May 13th from 15:00 to 16:00. To Register: https://docs.google.com/forms/d/e/1FAIpQLSdVoRio4D6H40D7NUHfDFi9VqCc0zI6clNis2q69xoVnv4F9g/viewform...
Technology webinar on the subject of: Design for Assembly (DFA). The technology webinar will take place on Thursday, April 2 from 14:00 to 15:00 by Evgeny Makhline, Nistec Design CTO. To join by Zoom: https://zoom.us/j/833621202?pwd=REpEc04vTmdDOTlwdnJ2Q3lNQjZRZz09
You are very welcome....
Technology webinar on the subject of: High Density Interconnection (HDI) PCB design. The technology webinar will take place on Thursday, March 26 from 14:00 to 14:40 by Evgeny Makhline, Nistec Design CTO. To join by Zoom: https://us04web.zoom.us/j/698865024?pwd=MkpJaWNHenhSVEhMKy9hUVo4V2lSUT09
You are very welcome....